Qualcomm MTK Hisilicon High-end CPU Battle
Qualcomm Snapdragon 810 will no doubt be the standard configuration of most flagship in 2015. In less than a month since New Year’s Day of 2015, already have LG G Flex 2 and Xiaomi Mi Note high-end version carries with Snapdragon 810. However, Qualcomm Snapdragon 810 had to be postponed until march because of the heating problem hasn’t been solved, and formal production should be postponed to the second quarter. In contrast, MTK and Hisilicon have got more achieves in high-end product line repeatedly. The significance of Qualcomm Snapdragon 810 is that it fills the high-end market blank before the appearance of independent architecture SOC.
For example, news about the new generation flagship of MT6795 has taken the lead in mass production. Also used four Cortex-A57 core + four Cortex-A53, the highest frequency reaches 2.2GHz, support 20.0MP camera, LTE Cat4 network, the highest download speed is 150Mbps, but the chip is still based on the existing 28nm process, instead of Qualcomm 810 used 20nm process.
Hisilicon cooperate with TSMC produced kirin 950 based on 16nm FinFET process(another saying, the SOC is kirin 930), and it has also been successful trial production, the SOC is based on the same Cortex-A57 64bit architecture, benefit from the use of 16nm process, its highest frequency up to 2.6GHz. It adopts TSMC heterogeneous CoWoS 3D IC packaging technology, 28nm I/O chip integrate 16nm logic chip, greatly reduces the cost, that is to say, it is not a complete 16nm technology products, a wide range of production may have to wait until the second half of 2015.
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